SikaBond® T-53

Polyurethane

SikaBond® T-53 has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

SikaBond® T-53 shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

+5 °C to +40 °C

SikaBond® T-53 maintains stable trowel marks.
SikaBond® T-53 is easily applied using guns or SikaBond® Dispensers.

+15 °C to +35 °C

40 % to 70 %

During laying and until SikaBond® T-53 has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without and between +20 °C and +35 °C with underfloor heating

Permissible substrate moisture content without underfloor heating:

• 2.5 % CM for cement screeds.
• 0.5 % CM for anhydrite screeds.
• 3–12 % CM for magnetite flooring (depending on the organic content).

Permissible substrate moisture content for use with underfloor heating:

• 1.8 % CM for cement screeds.
• 0.3 % CM for anhydrite screeds.
• 3–12 % CM for magnetite flooring (depending on the organic content).

Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer.

~3.0 mm/24 h (at +23 °C / 50 % r.h.)

~60 min (+23 °C / 50 % r.h.)

Sika^® AcouBond^®-System:

• ~500–600 mL/m² for SikaLayer^®-03 and ~500–600 mL/m² for SikaLayer^®-05. All cut-outs must be filled out. Use a triangular nozzle with a 8 x 10 mm opening.

Full Surface Bonding:

• 700−900 g/m² with notched trowel B3 (TKB Germany) e.g. for lam parquet, mosaic parquet and industrial parquet.
• 800−1000 g/m² with notched trowel B11 (TKB Germany) or P5 (US Standard) e.g. solid wood, engineered long-strips and panels, industrial parquet, other residential wood floors and paving, and chipboard.

Beaded Application:

• ~44 mL per running meter consumes 200–400 g/m², depending on bead spacing (solid wood boards, 3-ply engineered wood, chipboards).

For bonding long or wide boards, or when working on uneven substrates, it may be necessary to use a notched trowel with bigger notches to ensure that a sufficient amount of SikaBond® T-53 is applied to provide a uniform adhesive surface and prevent hollow sections i.e. without full surface bond.
For substrates primed with Sika^® Primer MR Fast or Sika^® Primer MB, the consumption of SikaBond® T-53 may be reduced.

For the application of SikaBond® T-53 all standard construction guidelines apply.
For further information, please refer to the Method Statement "Full Surface Bonding".

• The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
• Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
• Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
• Broadcast mastic asphalt must be primed with Sika^® Primer MR Fast or Sika^® Primer MB. For the instructions for use, please refer to the corresponding Product Data Sheet.
• Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika^® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
• Wood and/or gypsum boards (e.g. chipboard, plywood) must be glued and/or screwed to the substructure in order to be fixed to the substrate. For floating dry-floors, contact our Technical Service Department.
• For other substrates contact our Technical Service Department for advice and assistance.
• SikaBond® T-53 can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.

• For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika^® Primer MB. For detailed instructions contact our Technical Service Department.

Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® TopClean T. Once cured, residual material can only be removed mechanically.