SikaBond® T-53
THIXOTROPIC WOOD FLOORING ADHESIVE
SikaBond® T-53 is a 1-component, wood flooring adhesive with high viscosity.
- Adhesive can be sanded
- Floor can be walked on / sanded 12 / 24 hours
- Elastic, footfall-sound dampening properties
- Reduces stress transfer between the wood floor and the substrate
- Suitable for common types of wood floors
Usage
SikaBond® T-53 is designed for use with the Sika® AcouBond®-System and beaded application of solid wood boards (tongued and grooved), 3-ply engineered wood and chipboard floor systems and subfloors.Advantages
- Adhesive can be sanded
- Floor can be walked on / sanded 12 / 24 hours
- Elastic, footfall-sound dampening properties
- Reduces stress transfer between the wood floor and the substrate
- Suitable for common types of wood floors
Packaging
600 mL foil pack, 20 foil packs per box
Colour
Beige
Product Details
Composition
Polyurethane
Shelf life
SikaBond® T-53 has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.
Storage conditions
SikaBond® T-53 shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.
Density
~1.20 kg/L | (ISO 1183-1) |
Shore A Hardness
After 28 days | ~40 |
Tensile Strength
~1.8 N/mm2 | (ISO 37) |
Shear Strength
~1.20 N/mm2, 1 mm adhesive thickness | (ISO 17178) |
Service Temperature
+5 °C to +40 °C
Application
Sag Flow
SikaBond® T-53 maintains stable trowel marks.
SikaBond® T-53 is easily applied using guns or SikaBond® Dispensers.
Ambient Air Temperature
+15 °C to +35 °C
Relative Air Humidity
40 % to 70 %
Substrate Temperature
During laying and until SikaBond® T-53 has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without and between +20 °C and +35 °C with underfloor heating
Substrate Moisture Content
Permissible substrate moisture content without underfloor heating:
- 2.5 % CM for cement screeds.
- 0.5 % CM for anhydrite screeds.
- 3–12 % CM for magnetite flooring (depending on the organic content).
Permissible substrate moisture content for use with underfloor heating:
- 1.8 % CM for cement screeds.
- 0.3 % CM for anhydrite screeds.
- 3–12 % CM for magnetite flooring (depending on the organic content).
Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer.
Curing Rate
~3.0 mm/24 h (at +23 °C / 50 % r.h.)
Skin Time / Laying Time
~60 min (+23 °C / 50 % r.h.)
Consumption
Sika® AcouBond®-System:
- ~500–600 mL/m2 for SikaLayer®-03 and ~500–600 mL/m2 for SikaLayer®-05. All cut-outs must be filled out. Use a triangular nozzle with a 8 x 10 mm opening.
Full Surface Bonding:
- 700−900 g/m2 with notched trowel B3 (TKB Germany) e.g. for lam parquet, mosaic parquet and industrial parquet.
- 800−1000 g/m2 with notched trowel B11 (TKB Germany) or P5 (US Standard) e.g. solid wood, engineered long-strips and panels, industrial parquet, other residential wood floors and paving, and chipboard.
Beaded Application:
- ~44 mL per running meter consumes 200–400 g/m2, depending on bead spacing (solid wood boards, 3-ply engineered wood, chipboards).
For bonding long or wide boards, or when working on uneven substrates, it may be necessary to use a notched trowel with bigger notches to ensure that a sufficient amount of SikaBond® T-53 is applied to provide a uniform adhesive surface and prevent hollow sections i.e. without full surface bond.
For substrates primed with Sika® Primer MR Fast or Sika® Primer MB, the consumption of SikaBond® T-53 may be reduced.
APPLICATION INSTRUCTIONS
For the application of SikaBond® T-53 all standard construction guidelines apply.
For further information, please refer to the Method Statement "Full Surface Bonding".
SUBSTRATE PREPARATION
- The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
- Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
- Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
- Broadcast mastic asphalt must be primed with Sika® Primer MR Fast or Sika® Primer MB. For the instructions for use, please refer to the corresponding Product Data Sheet.
- Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
- Wood and/or gypsum boards (e.g. chipboard, plywood) must be glued and/or screwed to the substructure in order to be fixed to the substrate. For floating dry-floors, contact our Technical Service Department.
- For other substrates contact our Technical Service Department for advice and assistance.
- SikaBond® T-53 can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.
- For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika® Primer MB. For detailed instructions contact our Technical Service Department.
CLEANING OF EQUIPMENT
Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® TopClean T. Once cured, residual material can only be removed mechanically.